Decapsulation is the process of removing the protective outer casing or packaging of a semiconductor chip to expose its internal components, such as the silicon die and wiring. In cybersecurity and hardware analysis, decapsulation is often used to physically inspect, analyze, or reverse-engineer integrated circuits for vulnerabilities, security features, or intellectual property. Techniques for decapsulation can include chemical etching, mechanical milling, or laser ablation. While essential for certain types of chip analysis, decapsulation is a destructive process and can permanently damage the device. It is commonly used in security research, failure analysis, and forensic investigations to gain deeper insights into the hardware’s construction and security mechanisms.